Name: XC3S4000-5FGG900C
Brand: AMD
SKU: XC3S4000-5FGG900C
Availability: LimitedAvailability

Technical Specifications

Manufacturer	AMD
Part Number	XC3S4000-5FGG900C
Series	Spartan®-3
Indicated Status	Mature/Legacy (verification required)
Package / Case	900-BBGA
Temperature Range	0°C ~ 85°C (TJ)
Logic Elements	62208
LABs / CLBs	6912
Total RAM Bits	1769472
Number of I/O	633
Number of Gates	4000000
Supply Voltage	1.14V ~ 1.26V

Application Context

The XC3S4000-5FGG900C has been deployed across mature system architectures that remain in active service within industrial and embedded environments. Given its lifecycle stage, this FPGA is most commonly sourced today to support long-term maintenance programs, spare inventory replenishment, and controlled replacement of field-deployed units. Procurement decisions for this device typically prioritize continuity, traceability, and lot-level verification to ensure consistency with existing hardware baselines.

Compliance & Quality

Basic DocumentationCertificate of Conformance and traceability records provided.

Anti-CounterfeitSAE AS6081 testing protocols applied. Visual and X-ray inspection available.

EnvironmentalRoHS/REACH compliance information available upon request.

Additional NeedsSpecial testing or documentation discussed during inquiry.

Supply Chain Risk Assessment

Category	Level	Risk Factor	Mitigation
Supply Continuity	To be assessed	Lifecycle status requires verification	LTB assessment if applicable
Assembly Verification	Medium	BGA package may require X-ray inspection	Incoming inspection protocol

RFQQuick Inquiry Guide

To request a quotation for XC3S4000-5FGG900C, simply provide:

Required quantity (any amount accepted)
Target delivery schedule (flexible timelines welcome)

We will provide availability, pricing, CoC, and authenticity documentation.

Procurement FAQs

What is the current procurement protocol for verifying the availability of the XC3S4000-5FGG900C given its mature status?

Due to the 'Mature/Legacy' status of the XC3S4000-5FGG900C, stock levels are highly volatile and require formal verification through a current inventory audit. Availability is subject to verification at the time of RFQ, and lead times must be confirmed via a formal quote as legacy components may no longer be held in standard buffer stock.

Are there validated plain-text alternatives or cross-references for the 900-BBGA package configuration?

While functional equivalents may exist, any proposed cross-reference or alternative for the 900-BBGA footprint requires technical confirmation and engineering validation. Compatibility with existing PCB layouts is subject to verification against the specific '5FGG900C' speed grade and thermal specifications to ensure drop-in reliability.

What is the process for obtaining a Certificate of Conformance (CoC) for this legacy FPGA?

The provision of a Certificate of Conformance (CoC) for the XC3S4000-5FGG900C is subject to verification of the specific lot code and trace history. Documentation availability requires confirmation from the point of origin or authorized distribution channel to ensure compliance with B2B quality management standards for legacy semiconductors.

Same Architecture Variants

Identical logic resources with differences in speed grade, packaging, or I/O count:

XC3S4000-4FG676C | XC3S4000-4FG676I

Pin-to-pin compatibility must be verified per datasheet.

Design Scaling Consideration

For projects requiring additional logic resources within the same Spartan-3 family:

XC3S5000-5FGG900C

Resource headroom evaluation recommended before architectural migration.