XC3S5000-5FGG676C Procurement & Sourcing | AMD | B2B

AMD Spartan®-3 Procurement Reference

XC3S5000-5FGG676C

Global B2B Component Sourcing & Supply Chain Documentation

Sourcing Verified Quality Assured Compliance Tracked
Verification Note:

Indicated status: Mature/Legacy (verification required). RFQ submission required for real-time verification.

View Datasheet (PDF) Technical documentation for XC3S5000-5FGG676C

Application Context

The XC3S5000-5FGG676C has been deployed across mature system architectures that remain in active service within industrial and embedded environments. Given its lifecycle stage, this FPGA is most commonly sourced today to support long-term maintenance programs, spare inventory replenishment, and controlled replacement of field-deployed units. Procurement decisions for this device typically prioritize continuity, traceability, and lot-level verification to ensure consistency with existing hardware baselines.

Technical Specifications

Manufacturer AMD
Part Number XC3S5000-5FGG676C
Series Spartan®-3
Indicated Status Mature/Legacy (verification required)
Package / Case 676-BGA
Temperature Range 0°C ~ 85°C (TJ)
Logic Elements 74880
LABs / CLBs 8320
Total RAM Bits 1916928
Number of I/O 489
Number of Gates 5000000
Supply Voltage 1.14V ~ 1.26V

RFQQuick Inquiry Guide

To request a quotation for XC3S5000-5FGG676C, simply provide:

  • Required quantity (any amount accepted)
  • Target delivery schedule (flexible timelines welcome)

We will provide availability, pricing, CoC, and authenticity documentation.

Compliance & Quality

Basic DocumentationCertificate of Conformance and traceability records provided.
Anti-CounterfeitSAE AS6081 testing protocols applied. Visual and X-ray inspection available.
EnvironmentalRoHS/REACH compliance information available upon request.
Additional NeedsSpecial testing or documentation discussed during inquiry.

Supply Chain Risk Assessment

CategoryLevelRisk FactorMitigation
Supply Continuity To be assessed Lifecycle status requires verification LTB assessment if applicable
Assembly Verification Medium BGA package may require X-ray inspection Incoming inspection protocol

Procurement FAQs

What is the current procurement protocol for verifying the availability of the XC3S5000-5FGG676C given its legacy status?

Due to the 'Mature/Legacy' status of the XC3S5000-5FGG676C, real-time stock levels are subject to verification. Procurement requires confirmation of current factory lead times or existing buffer stock availability through a formal RFQ process before an order can be finalized.

Are there recommended plain-text alternatives or cross-references for this 676-BGA package if primary stock is exhausted?

Identification of functional alternatives or pin-compatible cross-references for the 676-BGA footprint requires confirmation from our technical engineering team. Any proposed substitute is subject to verification against your specific board timing and voltage requirements to ensure full compatibility.

What is the standard process for obtaining a Certificate of Conformance (CoC) for this specific FPGA?

The provision of a Certificate of Conformance (CoC) for the XC3S5000-5FGG676C is subject to verification of the specific lot's traceability documentation. Formal requests for CoC and date code restrictions require confirmation from the quality assurance department at the time of inquiry.

Same Architecture Variants

Identical logic resources with differences in speed grade, packaging, or I/O count:

XC3S5000-4FG676I | XC3S5000-4FG900C

Pin-to-pin compatibility must be verified per datasheet.

Design Scaling Consideration

For projects requiring additional logic resources within the same Spartan-3 family:

XC3S4000-5FGG676C

Resource headroom evaluation recommended before architectural migration.

Get Your Risk-Aligned Sourcing Options

Request quotation for XC3S5000-5FGG676C with feasibility assessment.